TENTATIVE
PP300B120
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
POW-R-PAK
TM
300A / 1200V
H-Bridge IGBT Assembly
Gate Drive Board Interface Signal Definitions
Phase A Error
Phase B Error
24 VDC input power
15 VDC input power
15 VDC input power
GND
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
Notes:
Signal Name
Shield
PWM A-
1
PWM A+
PWM B-
1
PWM B+
Not Used
Not Used
Not Used
Overtemp 1
Not Connected
DC Link Voltage
2
24 VDC input power 2
2
2
GND
GND
Heatsink Temperature
3
I out Phase A
GND 3
I out Phase B
Not Used
Not Used
Description
Connected to circuit ground
0-15 V signal controlling the duty cycle of A- IGBT
Open collector output, external pull-up resistor required
LOW = No Error; Floating = Phase A overcurrent or short circuit
0-15 V signal controlling the duty cycle of A+ IGBT
0-15 V signal controlling the duty cycle of B- IGBT
Open collector output, external pull-up resistor required
LOW = No Error; Floating = Phase B overcurrent or short circuit
0-15 V signal controlling the duty cycle of B+ IGBT
Open collector output, external pull-up resistor required
LOW = No Error; Floating = heatsink overtemp
Analog voltage representation of DC link voltage
20 – 30 VDC input voltage range
20 – 30 VDC input voltage range
14.4 – 18 VDC input voltage range
14.4 – 18 VDC input voltage range
Ground reference for 15 and 24 VDC inputs
Ground reference for 15 and 24 VDC inputs
Analog voltage representation of heatsink temperature
Tied to pins 18 and 19
Analog voltage representation of phase A output current
Tied to pins 18 and 19
Analog voltage representation of phase B output current
1.
2.
3.
Open collectors can be pulled up to 30 V max and sink 50mA continuous.
Do not connect a 15 VDC and 24 VDC source to the unit at the same time, use one or the other.
GND signals to be used for analog feedback signals, i.e. twisted pair with I out Phase A.
Gate Drive Board Interface Connector
Description
Gate Drive Board Interface Header
Recommended Mating Socket
Recommended Strain Relief
PP300B120(-)
Symbol
J1
-
-
Type
0.100” x 0.100” latching header, 26 pin
0.100” x 0.100” IDC socket, 26 pin
Plastic strain relief
Manufacturer
3M# 3429-6002 or equivalent
3M# 3399-7600 or equivalent
3M# 3448-3026 or equivalent
-4-
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相关代理商/技术参数
PP300B120-ND 制造商:POWEREX 制造商全称:Powerex Power Semiconductors 功能描述:H-Bridge POW-R-PAK IGBT Assembly 300 Amperes/1200 Volts
PP300D060 功能描述:IGBT ASSY H-BRIDGE 600V 300A RoHS:否 类别:半导体模块 >> 功率驱动器 系列:POW-R-PAK™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块
PP300D120 功能描述:IGBT ASSY HBRIDGE 1200V 300A RoHS:否 类别:半导体模块 >> 功率驱动器 系列:POW-R-PAK™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块
PP300T060 功能描述:IGBT ASSEMBLY 3-PHASE 600V 300A RoHS:否 类别:半导体模块 >> 功率驱动器 系列:POW-R-PAK™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块
PP300T060-ND 制造商:POWEREX 制造商全称:Powerex Power Semiconductors 功能描述:3-Phase POW-R-PAK IGBT Assembly 300 Amperes/600 Volts
PP300T120 功能描述:IGBT ASSEMBLY 3PHASE 1200V 300A RoHS:否 类别:半导体模块 >> 功率驱动器 系列:POW-R-PAK™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块
PP300T120-ND 制造商:POWEREX 制造商全称:Powerex Power Semiconductors 功能描述:3-Phase POW-R-PAK IGBT Assembly 300 Amperes/1200 Volts
P-P301PA 制造商:Panasonic Industrial Company 功能描述:BATTERY SUB:P-P301PA/1B